2023 LED lamp Market Trends 1:

The sales of indoor LED lamps increased by about 19%, while outdoor LED lamps were more significant, with an increase of about 78%. 

This growth is mainly due to the rapid recovery of the rental market and the popularity of naked eye 3D applications.

In terms of indoor LED lamps, the most significant changes occur in 1010 and below, which are greatly affected by COB. 

Among them, the proportion of N-to-1 is only about 1.7%, and this proportion continues to decrease.

In terms of outdoor LED lamps, 1921 accounted for about 51%, while 1415 accounted for about 28%. 

These two specifications of LED lamps together account for about 80%, showing a significant concentration of demand for outdoor LED lamps.

2023 LED Market Trends 2

From the perspective of pixel pitch sales,in 2023, ≤ P2.5 accounted for approximately 64.81% of all display screen sales, 

a decrease from 70% in 2022, mainly due to an increase in outdoor demand this year.

COB technology has received much attention, with sales of approximately $2.29 billion USD in 2022 and increasing to approximately $2.86 billion USD in 2023, 

an increase of approximately 25%. In addition, COB sales account for approximately 30.4% of the total sales below P1.25 (including P1.25).

The growth rate of fine-pitch LED displays is about 11%, indicating that the phase of rapid growth for fine-pitch displays is largely concluded.

The Future Exploration of LED Display Screens in the 4K and 8K Era

The resolution of the signal source is evolving, transitioning from 2K to 4K and eventually to 8K, marking an industry trend.

The TV industry has successfully upgraded from 2K to 4K and is now launching 8K TVs, while film production mirrors this progression.

From this standpoint, LED displays find themselves relatively behind, prompting the need to shift from 2K to 4K and finally to 8K as the signal source advances.

In many outdoor application scenarios, different sizes of displays can be assembled according to needs to achieve 4K or 8K display. 

However, in most indoor settings, this is not practical due to the limitations of floor height. There are certain limitations on the height of both office buildings and residential buildings. 

We can almost speculate that in the 4K and 8K eras, the pixel pitch of LED displays will decrease to P1.5 or even below P0.9. In other words, there may not be products above P1.5 in the 4K era, and there may not be products above P0.9 in the 8K era.

In the next generation of display technology, the core issue is how to achieve pixel pitch of P0.9 or even smaller in the 4K and 8K eras.

The challenges in traditional SMD:

- Difficulties in achieving below P0.9

- High failure rates

- Inadequate protection

- Challenges in enhancing reliability

- Nearing cost limits

- Facing overcapacity

Due to the constraints of chip electrode size, further reduction is not feasible. Technological and product innovations are nearly at a standstill.

Three Mainstream Technology Routes for Mini Packaging：

 1. Single Lamp Packaging:

Transitioning from regular chips to inverted chips enhances reliability. Inverted chips enable smaller sizes and reduced pixel pitch. 

However, shrinking lamps may lead to fragile solder pads. A combination with surface protection like GOB technology, 

using colloids for protection, is necessary—similar to the backend technology route of COB.

2. Integrated Packaging:

Also known as 4-in-1 or N-in-1. Larger lamps and less fragile solder pads provide a relative advantage. 

However, surface protection remains essential.

3. Pure COB Packaging, Divided into Two Types:

-Chip COB (Direct Solidification of Chips onto Substrates):

Applicable to both PCB and glass substrates.

MIP COB (Mini LED Packaging):

Involves packaging the light-emitting chip into a separate unit (i.e., LEDs), then fixed onto the substrate. 

The technical route of single lamp packaging and 4-in-1 integrated packaging with GOB is not fundamentally different from MIP COB in the first half. 

Both involve packaging the light-emitting chip into an independent body and mounting it onto the substrate. The difference lies in the later stage, where single lamp packaging and 4-in-1 use surface mount technology, while MIP employs solid-state technology.

COB Technology Debate: Seeking Solutions for the Future

In the past two to three years, the industry has been debating which technological route can achieve victory, 

and all parties are hoping to find the answer. However, this debate has now become of little significance. Due to COB technology, 

both Chip COB and MIP COB technologies have fallen into a dilemma.

1. In terms of cost competition with traditional surface mount packaging, P0.9 or higher does not have an advantage.

2. With the transition of signal sources from 2K to 4K and then to 8K, there has been a significant shift in cost logic. 

Although Mini and Micro chips may have lower prices, what about the costs of substrates, drivers, processes, and other aspects? 

It may increase instead of decreasing.

How to achieve the transition of LED display screens from 2K to 4K and then to 8K at a low cost?

Based on our industry observations, some experts believe that combining dynamic pixels/virtual pixels/dynamic technology/sub-pixels (no standardized terminology yet) with COB technology may bring enormous value to the industry.

1. Low-cost implementation of the transition from 2K to 4K to 8K:

For example, at the same price as P1.8, through dynamic pixel multiplication technology, 2K becomes 4K, and 4K becomes 8K.

2. Breakthrough in outdoor micro pixel pitch: 

In the past, achieving a pixel pitch below P2 outdoors was nearly impossible. However, using dynamic pixel technology can achieve effects similar to P1.5 in outdoor P3 and P1 in outdoor P2.

3. The era of micro pixel pitch in rental products:

Historically, rental products struggled to achieve below P2. Yet, with the use of dynamic pixel technology, P3.91 instantly becomes P1.96, and P2.6 instantly becomes P1.3, ushering in the era of micro pixel pitch in rental products.

This logic is that the cost price remains unchanged, but the product performance significantly improves, similar to the field of consumer electronics. Each mobile phone brand launches flagship phones every year, 

with little price change, but product performance has significantly improved.

Dynamic pixel technology for LED display screens?

Is this technical solution feasible? If so, to what extent has this technology progressed? When will it mature for application? What problems may occur, such as:

1. What is the comparison effect between P1.8 and P0.9 achieved after dynamic pixels? Would it be better?

2. Can text and linear graphics be displayed normally?

3. Will it affect professional shooting, such as XR?

If this technology is successfully implemented, the demand for the entire LED display screen industry will significantly increase. 

Well, as we know, exploring this innovative approach is still in its nascent stages, and we eagerly anticipate further developments.

LED Display Control systems, some observations on the R&D direction

1. Combine HUB, power supply, and receiving card together:

-Advantages: Simplify installation and maintenance, reduce the number of system components.

-Challenge: Integration may increase device complexity and require ensuring performance and stability.

2. From traditional RG45 network cable transmission to Typec transmission, and then to wireless transmission:

-Advantages: Improve data transmission speed, reduce wiring costs, and increase flexibility.

-Challenge: Wireless transmission may be affected by interference, ensuring stable signal quality. Type-C transmission requires consideration of device compatibility and stability.

3. COB/GOB/MLED/Rental screen full screen calibration is being automated on the production line to complete calibration:

-Advantages: Improve production efficiency, reduce manual intervention, and ensure display screen quality.

-Challenge: A highly precise automation system is required to ensure that each screen is accurately calibrated.

4. Control scheme without sending and receiving cards, i.e. fusion of control system and driver:

-Advantages: Simplify system architecture, reduce hardware components, and improve integration.

-Challenge: It is necessary to ensure that the fused system still meets performance requirements, 

which may require more complex software and algorithms.

Overall, we believe that these directions involve challenges in technological innovation and system integration. 

When promoting these research directions, careful consideration needs to be given to factors such as technological feasibility, stability, cost-effectiveness, and user experience.

Aole Observation:

 As a specialized service provider in the LED display screen industry, we offer service support related to LED display globally. 

We consistently share current industry developments and potential future trends. We hope this information proves valuable to you.  

If you have an interest in any specific topic, feel free to reach out to us at any time.